1 or 2 chases / 2 or 4 strips

Clamping force up to 200 tons

Integrated de-gate tooling

Dynamic Insert Technology for packages with exposed areas/ packages open area on the chip

Very versatile system for fast and easy conversion between different packages

Works with lead frame, substrate and ceramic carriers as well as individual modules

Maximum Leadframe / panel dimensions 255x75mm

Metal surfaces of the mold are kept clear of molding compound

The use of a large variety of molding compounds, including very sticky types and liquid silicone materials

No, single or double film

Maximum Leadframe / panel dimensions 300x100mm

Integrated cassette handlers

Class 100 cleanroom option for optical devices

Extremely long life-time of tooling resulting in very low running costs

Large list of system options for increasing production efficiency, process control and guaranteeing the best quality

Secs-Gem communication package for interfacing with a customer’s MES system, production traceability and recipe management

Many options standard available for enabling fast change-overs, productivity improvements and quality assurance