Unistar Innovate-2-NF/FF-L

Unistar Innovate-2-NF/FF-L

The most universal semi-automatic molding system designed for conventional packages. Suitable for small to medium sized production volumes. Noted for very short conversion times when moving from one package to another and low cost tooling.

For more infomation

Contact
Unistar Innovate-2-NF/FF-L

Key specifications and values

1 chase for 1 or 2 strips

Clamping force up to 100 tons

Integrated de-gate tooling

Dynamic Insert Technology for packages with exposed areas/ packages open area on the chip

Very versatile system for fast and easy conversion between different packages

Works with lead frame, substrate and ceramic carriers as well as individual modules

Maximum Leadframe / panel dimensions 255x75mm

Metal surfaces of the mold are kept clear of molding compound

The use of a large variety of molding compounds, including very sticky types and liquid silicone materials

No, single or double film