Overview of the event

On March 20-22, 2024, SEMICON China Exhibition was grandly held at the Shanghai New Expo Center, attracting semiconductor companies and professionals from all over the world. Suzhou Boschman Semiconductor Equipment Co., Ltd. (Boschman) participated in the exhibition with the theme of "providing one-stop high-quality packaging design, silver sintering and injection molding solutions", which received wide attention.

Booth Highlights

Interactive experience: The exhibition provided product display and explanation for the visiting customers, and provided detailed equipment demonstration videos, so that customers can understand the products and technologies of Baoshiman.

Technical highlights: With core technologies such as DIT and DFAM, it has always been in a position in the fields of silver sintering and plastic molding. Prosman has also brought more cutting-edge packaging technologies and applications.

Product innovation: Borsman brought the small sintering machine Sinterstar Mini and the rotor molding machine to the exhibition.

Sample Display

At this exhibition, the sintering application cases such as module sintering and T-PAK sintering exhibited by Prosman fully reflect the rich experience and mature technology of Prosman in the field of sintering. In addition, Borsman also brought cutting-edge application cases such as MEMS&Sensor packaging, motor rotor packaging, and TPV technology.

On-site Experience

The booth was crowded with visitors.

The technical staff of the booth had in-depth technical exchanges and discussions with the visitors, sharing new technologies and industry trends. Visitors showed great interest in the exhibits exhibited by Borsman, and participated in technical exchanges and product consultations.

Exhibition Summary

As a pioneer and leader in the field of silver sintering, Baoshiman has accumulated mature technology and experience to continue to provide customers with stable and reliable sintering equipment, and is also committed to promoting the application of sintering technology.

In addition, with more than 30 years of exploration and innovation in the field of plastic packaging, Baoshiman is constantly exploring more packaging solutions in many fields such as module packaging, packaging, MEMS & Senor packaging, motor rotor packaging, etc., and we look forward to working with you to change the world with innovation.

Thanks

thank you to the customers, partners and visitors who participated in this exhibition!